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The heatsink for Compute Module 5 is a passive cooling solution designed to ensure continuous heat dissipation from the SoC. It uses an aluminium radiator combined with thermal pads to ensure even heat transfer to the surface of the heatsink.
Technical characteristics
| Specifications | |
|---|---|
| Product type | Heatsink |
| Material | Anodised aluminium |
| General | |
|---|---|
| Dimensions | 56 x 41 x 12.7mm |
| Color | Black |
| Package | Heatsink Thermal pads |