Très bon câble et service client de qualité LE câble a bien amélioré la qualité du son par rapport au câble ordinaire d'origine tout en restant d'un coût...
The heatsink for Compute Module 5 is a passive cooling solution designed to ensure continuous heat dissipation from the SoC. It uses an aluminium radiator combined with thermal pads to ensure even heat transfer to the surface of the heatsink.
This silicon thermal pad, sold in a size of 100x100x8mm and cuttable, ensures a better thermal dissipation of electronic components releasing heat. Its silica gel ensures a high thermal conductivity of 1.5W/m.k for an efficient heat dissipation.
The thermal glue type ST922 offers real efficiency for power transistors or dedicated audio controllers. Offering a thermal conduction of 0.671 W/m-k, it will find its place in all DIY projects.