This silicon thermal pad, sold in a size of 100x100x8mm and cuttable, ensures a better thermal dissipation of electronic components releasing heat. Its silica gel ensures a high thermal conductivity of 1.5W/m.k for an efficient heat dissipation.
The thermal glue type ST922 offers real efficiency for power transistors or dedicated audio controllers. Offering a thermal conduction of 0.671 W/m-k, it will find its place in all DIY projects.